Bonding camera modules

In the electronics sector adhesives are used in particular for mobile phone and smartphone camera modules. This includes bonding of individual parts – such as the lens into the lens mount or the lens mount onto the camera sensor –, fixing the camera chip onto the circuit board (die attach), use of the adhesive as chip underfill, bonding low-pass filters and gluing the assembled camera modules into the device housing.

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Special adhesives allow precise assembly and durable bonding of ever smaller camera module components. The adhesives used are suitable for large-scale production of camera modules and cure quickly at low temperatures.

The table below lists a selection of adhesives that are recommended for bonding camera modules. Further products and custom solutions are available on request.

To download the technical datasheets (TDS) please click on the adhesive name.

Bonding of camera modules and lens bonding

Adhesive	Application Areas	Viscosity [mPas]	Base	Curing *	Special Properties
Vitralit® UD 5134	-	15,000-25,000	acrylate	UV VIS secondary heat cure	Acrylate-Hybrid low thermal expansion low shrinkage impact resistant dry surface grey color
Vitralit® UV 2113	Potting Sealing Protection of sensitive components	19,000-32,000 (Rheometer, 25°C, 10s^-1)	acrylate	UV VIS	Acrylate hybrid superior strength low thermal expansion impact resistant low shrinkage resistant to soldering stress excellent flow properties
Vitralit® UV 2115	-	20,000-30,000 (Rheometer, 25°C, 50s^-1)	acrylate	UV VIS	Acrylate hybrid superior strength low thermal expansion low shrinkage impact resistant resistant to soldering stress paste-like stable and high viscous