Elecolit®: Conductive Adhesives

The Hoenle product line of Elecolit^® conductive adhesives are both electrically and thermally conductive adhesives. Conductive adhesives are an innovative alternative to conventional soldering processes, enabling reliable electrical connections while reducing thermal stress on sensitive components. Elecolit^® conductive adhesives combine excellent electrical conductivity with strong adhesion to a wide range of substrates, including metals, ceramics, glass, and engineering plastics. They are widely used in electronics manufacturing, automotive applications, sensors, RFID systems, printed electronics, and advanced semiconductor packaging where precision and long-term performance are essential.

Designed for demanding industrial applications, Elecolit^®  conductive adhesives offer outstanding conductivity, process flexibility, and durability under challenging environmental conditions. Available in silver-filled and specialty formulations, these electrically conductive adhesives support low-temperature curing and are suitable for dispensing, screen printing, and automated production processes. By enabling efficient electrical contact and reliable component assembly, Elecolit^®  helps manufacturers improve product quality, increase design freedom, and optimize production efficiency across a broad range of electronic applications.

Elecolit^® – Our brand for electrically or thermally conductive adhesives

Elecolit^® adhesives can be thermally and/or electrically conductive

The percentage of conductive filler greatly influences the degree of conductivity within the adhesive. With a higher fill ratio, conductivity increases due to the fact that more conductive particles come in contact with each other to create a conducting path. Conductivity can further be improved through the size and geometry of the conductive particles that are used to fill the adhesive.  The adhesive curing process also plays a significant role in maximizing conductivity. Shortened curing cycle times and excessively low curing temperatures can lead to low crosslinking density.  This condition can permit the random displacement of the metallic fillers by external mechanical influences.  Too short curing times or too low curing temperatures lead to the occurrence of low crosslinking density and the build-up of excessive bonding stresses within the adhesive.

Until recently, the curing of conductive adhesives was a slow process. Thanks to new hardener systems, conductive adhesives can be now cured within a few minutes: Several one-part Elecolit^® conductive adhesives have been modified for snap-curing ability.

Elecolit^® conductive adhesives are relatively simple to apply. With the appropriate selection of filler type, they can be dispensed through automated valves, high speed jet dispensing systems, and screen printing. Hoenle provides an extensive Elecolit^® product portfolio of one- and  two-part conductive adhesives.

Do you have any questions or need support for our bonding solutions? We are happy to help you.

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