Adhesives for Photovoltaics and OPV
Bonding technologies play a key role in advancing organic photovoltaics (OPV) and flexible electronics — from indoor light harvesting for wearables to ultra‑flexible outdoor energy systems. Today’s adhesives offer far more than structural bonding — they add functionality, durability, and process efficiency.
Hoenle has worked closely with partners and customers to develop a portfolio of multi-functional adhesives designed specifically for OPV and flexible electronic applications. These formulations deliver enhanced environmental resistance, optimized barrier foil lamination, and reliable conductive bonding for SMD components in flexible packaging.
Choosing the right adhesive means aligning material properties, curing behavior, and assembly requirements. When perfectly matched, manufacturers gain greater design freedom, higher process efficiency, and improved throughput in high volume production, including reel to reel.
On the right side: An electrically conductive adhesive is dispensed into laser-cut holes for the electrical connection of flexible solar films.
Supporting Rapid OPV Evolution
As OPV technologies evolve rapidly and remain largely unstandardized, adhesives must be adapted or newly developed to meet unique material and process demands — a challenge Hoenle actively supports with tailored solutions.
Organic Photovoltaic and flexible electronics manufacturing lacks standardization and changes quickly. Hoenle supports this dynamic field through:
- material‑specific adhesive adjustments
- custom developments
- solutions for unique device architectures and processes
Download
In the following tables you will find a selection of Hoenle adhesives suitable for OPV and photovoltaic assembly applications. Other products or customized solutions are available on request. To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Application Areas | Viscosity [mPas] | Base | Curing | Special Properties |
|---|---|---|---|---|---|
|
10,000 – 15,000 (Rheometer 10s^-1) | epoxy | thermal |
|
|
| - | 7,000-10,000 (Rheometer, 25 °C, 10^s-1) | epoxy | thermal |
|
|
| - | 1,300 - 1,600 (Rheometer, 25 °C, 10s^-1) | acrylate | UV/VIS |
|
|
| - | 1,500 - 2,000 (Rheometer, 25 °C, 10s^-1) | epoxy | UV/VIS/thermal |
|
|
| - | 6,200 (Rheometer, 25 °C, 10s^-1) | hybrid | UV/VIS |
|
*UV = 320 – 390 nm VIS = 405 nm
Contact And Support
Do you have any questions or need support for our bonding solutions? We are happy to help you.
