Electronic Component Potting
Electronic components inherently require protection from moisture and mechanical damage. For this reason, they are typically sealed with materials offering protective properties. Components such as capacitors, switches, and relays are typically designed with shallow cavities for containment, so that low viscosity potting materials may be dispensed quickly during automated production.
Hoenle offers single component, light curable potting materials of the Vitralit® brand, or thermally curing potting compounds of the Structalit® line. Both adhesive brands are specifically formulated to act as barriers against contamination, chemicals, moisture, and handling damage. These materials dispense easily, cure quickly, and provide a protective surface that is dry and tack-free. Hoenle’s broad selection of potting materials bond to a variety of substrates including ABS, nylon, polycarbonate, and plated metals.
Adhesives of the Vitralit® line are light curable potting materials. They are single component and solvent-free, and are easily dispensed from automated valve dispensing systems. A wide range of viscosities are available to meet component configuration and processing challenges. When cured, these materials exhibit dry, tack-free surfaces that resist contamination from airborne particulates and handling. Light curable materials are available with a secondary moisture or thermal cure catalyst in the event that shadowed areas exist in the potting field.
LED curable adhesives are included in Hoenle’s product selection for electronic component potting and encapsulating. These adhesives fully cure in fractions of a second under low intensity UV or Visible light. They are ideal for use with LED light curing units; depending on the irradiation surface, Hoenle’s floodlights are particularly suitable.
Structalit® adhesives are solvent free single or two-component adhesives. They are mostly based on epoxy resin and can be cured at room temperature or by exposure of heat. For heat-sensitive components low temperature curing adhesives are available.
Try our new single component epoxy adhesives that cure at low temperatures (60 C°). These products are ideally suited for potting temperature sensitive components.
View the potting products listed below for a possible candidate for your application. Please contact Honele to confirm your product selection and to secure additional application assistance, including samples and process recommendations. Other products or customized solutions are available on request. To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Viscosity [mPas] | Base | Curing * | Special Properties |
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| 1,200-2,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal at 60°C |
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| 5,000-10,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal at 60°C |
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| 7,000-15,000 mix (LVT, 25°C, Sp. 4/30 rpm) | 2-part epoxy | thermal, room temperature |
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| 12,000-22,000 mix, 10,000-20,000 part A, 18,000-29,000 part B, (Rheometer, 25 °C, 10s^-1) | 2-part epoxy | thermal, room temperature |
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| 40,000-65,000 mix (Rheometer, 25°C, 10s^-1) | 2-part epoxy | thermal, room temperature |
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| 3,000-4,000 mix (LVT, 25°C, Sp. 4/30 rpm) | 2-part epoxy | thermal room temperature |
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| 20,000-30,000 (Rheometer, 25 °C, 20s ^-1) | epoxy | thermal |
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| 3,000-5,000 | epoxy | UV secondary heat cure |
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| 3,000-5,000 | epoxy | UV |
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| 9,000-14,000 (Rheometer, 10s^-1) | epoxy | UV secondary heat cure |
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| 1,300 - 1,600 (Rheometer, 25 °C, 10s^-1) | acrylate | UV/VIS |
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| 4,000-6,000 | epoxy | UV secondary heat cure |
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| 8,000-11,000 (Rheometer, 25 °C, 5s-1) | acrylate | UV VIS secondary moisture cure |
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| 6,000 (Rheometer, 25 °C, 10s-^1) | acrylate | UV VIS secondary moisture cure |
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*UV = 320 – 390 nm VIS = 405 nm
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