Encapsulation of Electronic Components

Epoxy and acrylate resin based sealing and potting compounds are often used in electronics to protect electronic components, semiconductors and subassemblies. The encapsulation protects components from moisture, dust, dirt and solvents. Used to fill cavities or encapsulate components, sealing compounds also provide effective protection from mechanical stress.

All Hoenle sealing or potting compounds are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.

Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production. Thermally curing potting compounds, on the other hand, have the advantage of curing even in dark areas that the UV light cannot reach. These encapsulants are also available in black colour for use as a coating or covering.

A black sealing compound is used to protect mass-produced chips

The table below lists a selection of encapsulants, sealing and potting compounds from Hoenle. Further products and custom solutions are available on request.

Encapsulation with black adhesive

A black adhesive is used for encapsulating electronic components

To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Application Areas Viscosity [mPas] Base Curing * Special Properties
- 1,200-2,000 (Rheometer, 25°C, 10s^-1) epoxy thermal at 60°C
  • Non-conductive
  • Outstanding adhesion to high performance
  • plastics (LCP, PBT)
  • High purity
  • Electronic grade standard
  • Flexible
- 5,000-10,000 (Rheometer, 25°C, 10s^-1) epoxy thermal at 60°C
  • Non-conductive
  • Outstanding adhesion to high performance plastics (LCP, PBT)
  • High purity
  • Electronic grade standard
  • Good mechanical stability
  • Good chemical resistance
- 7,000-15,000 mix (LVT, 25°C, Sp. 4/30 rpm) 2-part epoxy thermal, room temperature
  • High temperature resistance
  • short pot life
  • fast application
- 12,000-22,000 mix, 10,000-20,000 part A, 18,000-29,000 part B, (Rheometer, 25 °C, 10s^-1) 2-part epoxy thermal, room temperature
  • Black color
  • Excellent oil, chemical and moisture resistance
  • Low shrinkage
  • Low water absorption
  • Good adhesion to metal, glass and plastics
- 40,000-65,000 mix (Rheometer, 25°C, 10s^-1) 2-part epoxy thermal, room temperature
  • Dark grey color
  • Excellent oil, chemical and moisture resistance
  • Low shrinkage
  • Low water absorption
  • Good adhesion to metal, glass and plastics
  • Flame classification based on UL 94 HB
- 3,000-4,000 mix (LVT, 25°C, Sp. 4/30 rpm) 2-part epoxy thermal room temperature
  • Very high adhesion to PC
  • resistant to moisture and chemicals
  • glob top encapsulation
  • plastic bonding
  • SMD assembly
25,000-50,000 ( Rheometer, 25 °C, 10s-1 ) epoxy thermal
  • Black color
  • fast curing at low temperatures
  • impact resistant
  • Frame-material for frame&fill
80,000-150,000 (Rheometer, 25 °C, 10s^-1 ) epoxy thermal
  • Black color
  • stable frame material, can be applied wet-in-wet with filling material, suitable for frame stacking
  • stable edges
  • resistant to shocks
  • needle bonding
  • plastic bonding
6,000-10,000 (Rheometer, 25°C, 10s^-1) epoxy thermal
  • Black color
  • excellent flow properties
  • filling material for frame&fill applications
  • high resistance to heat and chemicals
  • certified to ISO 10993-5 standards
  • Glob top encapsulation
  • Encapsulation of electronic components
  • Bonding of electronic components
  • Fill material for frame&fill
20,000-30,000 (Rheometer, 25 °C, 20s ^-1) epoxy thermal
  • Black color
  • excellent flow properties
  • filling material for frame and fill applications on PCBs,
  • very high resistance to heat and chemicals
  • Attaching components on PCBs,
  • Encapsulation of electronic components,,
  • Encapsulation of plastic parts,
  • Potting material
30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm) epoxy thermal
  • Epoxy-based resin
  • resistant to high temperatures and oil/grease
  • perfect choice for ring applications
- 30,000-45,000 epoxy thermal
  • Resistant to oils, grease and fuels
  • black color
  • excellent flow properties
- 16,000-30,000 (Rheometer, 25 °C, 5s^-1) epoxy thermal
  • Resistant to oils, grease and fuels;
  • Stable;
  • Fast curing at low temperatures
- 30,000-45,000 epoxy thermal
  • Resistant to oils, grease and fuels
  • excellent flow properties
  • beige color
  • Attaching components on PCBs;
  • Encapsulation or potting of electronic components
6,500-7,500 (Rheometer, 25°C, 20s^-1) epoxy thermal
  • Black color
  • flexible potting compound
  • excellent flow properties
  • Glob Top
  • Potting Material
  • Encapsulation of electronic components
  • Conformal Coating
3,000-5,000 epoxy UV secondary heat cure
  • Very high Tg
  • low water absorption
  • low ion content
  • very high chemical resistance
  • optical cement
  • lens bonding cement
  • glass bonding
  • medical device bonding
200-400 (LVT, 25°C, Sp. 2/30 rpm) epoxy UV secondary heat cure
  • low shrinkage
  • low heat expansion
  • very high tg
  • excellent chemical resistance
  • certified to ISO 10993-5 standards
  • Fill for frame&fill
3,000-5,000 epoxy UV
  • Electronic grade
  • low ion content
  • suitable for chip protection
  • UL94 HB test passed
  • Medical devices bonding
  • Flexible potting
  • Optics
150-300 (Brookfield LVT, 25 °C, Sp. 2/30 rpm) epoxy UV secondary heat cure
  • flexible
  • certified to USP Class VI and ISO 10993-5 standards
  • resistant to all common sterilization methods
  • Frame material for frame & fill applications
9,000-14,000 (Rheometer, 10s^-1) epoxy UV secondary heat cure
  • Stable frame compound
  • high ion purity
  • electronic grade adhesive
  • high temperature conductivity
  • low water absorption
  • UL94 HB test passed
  • glob top encapsulation
  • conformal coating
  • encapsulation of electronic components
  • chip encapsulation
  • potting material
  • smart card
1,200-2,000 epoxy UV
  • Excellent flow properties and leveling
  • electronic grade adhesive
  • low ion content
  • suitable for chip protection
  • excellent resistance to heat and humidity
  • Fill for frame&fill
20,000-40,000 epoxy UV secondary heat cure
  • black color
  • high ion purity
  • electronic grade adhesive
  • high temperature resistance
  • fast surface curing with UV light
- 5,000-8,000 (LVT, 25 °C, Sp. 4/30 rpm) epoxy UV
  • Very high adhesion to most thermoplastics
  • low shrinkage
  • high temperature resistance
- 60-100 (LVT, 25 °C, Sp. 2/30 rpm) epoxy UV secondary heat cure
  • fluorescing
  • flexible
  • autoclavable
  • dry surface after curing
  • low ion content
  • sprayable
- 150-350 (LVT, 25 °C, Sp. 2/30 rpm) epoxy UV secondary heat cure
  • fluorescing
  • flexible
  • autoclavable
  • excellent chemical resistance
  • low ion content
- 100-200 epoxy UV secondary heat cure
  • fluorescing
  • flexible
  • autoclavable
  • high chemical resistance
  • low ion content
  • Conformal Coating,
  • Encapsulation of electronic components
160-300 epoxy UV secondary heat cure
  • Dry surface after UV-curing
  • autoclavable
  • excellent chemical resistance
  • scratch resistant coating
- 2,000-3,000 (LVT, 25 °C, Sp. 4/30 rpm) acrylate UV, VIS
  • soft and elastic
  • dry surface after curing
  • protective coating
  • fast curing
  • fluorescing blue
  • Sealing electrical assemblies,
  • breathing masks
250-500 acrylate UV VIS
  • Flexible,
  • well suited for bonding plastics with low UV translucence and permeable to visible light,
  • biocompatible: certified to USP Class VI standards
Vitralit® 6103
- 3,500-5,000 acrylate UV secondary heat cure
  • Very high adhesion to metals and sintered materials
  • transparent
  • Encapsulation of electronic components
3,000-8,000 acrylate UV secondary heat cure
  • Very high adhesion to metals and sintered materials
- 8,000-17,000 (Rheometer, 25°C, 10s^-1) acrylate UV secondary heat cure
  • Very high adhesion to metals and sintered materials
  • ideal for bonding large components on circuit boards (corner bonding)
Vitralit® 6105
- 3,500-6,000 acrylate UV secondary heat cure
  • very high adhesion to metals and sintered materials
- 4,000-6,000 (LVT 25°C, Sp. 4/30 rpm) acrylate UV secondary heat cure
  • excellent adhesion to stone, glass, metals and thermoplastics
  • medium viscosity
- 800-1,200 acrylate UV secondary heat cure
  • very high adhesion to stone, glass, metals and thermoplastics
  • high temperature resistance
- 3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV secondary heat cure
  • contains chemical activator
  • high temperature resistance
  • high viscosity
  • excellent adhesion to stone, glass, metals and thermoplastics
- 200-400 acrylate UV
  • Fast curing
  • very well suited for automated production lines
  • yellow color
  • dry surface
- 700-1,200 acrylate UV
  • Dry surface
  • fast curing of thick layers
  • yellow color
- 4,000-7,000 acrylate UV
  • Yellow color
  • dry surface
  • fast curing of thick layers
  • Fixing components,
  • sensor encapsulation in automotive/aerospace industry,
  • bonding lenses,
  • bonding plastic parts and plastic housings
4,000-6,000 epoxy UV secondary heat cure
  • Perfect solution for bonding flexible circuit paths
  • resistant to reflow processes
  • grey color
  • Protective encapsulation of electronic components on PCBs
  • Consumer electronics
5,000-8,000 (Rheometer, 25°C, 10s^-1) acrylate UV VIS moisture cure
  • High Tg
  • Fast curing
  • Compatible with flux
  • Low ion content
  • Consumer Electronics
  • Protective encapsulation of electronic components on PCBs
3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV / VIS / Moisture postcuring
  • High Tg, fast curing
  • Compatible with flux
  • Low ion content
  • Passed UL94 HB test
  • Encapsulation of electronic components
1,000-1,500 acrylate UV VIS
  • Elastic
  • high peel strength
  • optically clear
  • very flexible
  • suitable for potting

*UV = 320 – 390 nm          VIS = 405 nm

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