Adhesives for Applications in Optoelectronics
Optoelectronics comprises all products and processes that enable the conversion of electrical signals into optical signals and vice versa.
Special adhesives are used to manufacture optoelectronic products. For example, optically transparent and non-yellowing adhesives are used as glob tops for diodes or LEDs. Hoenle products are filled with special nanoscale filler particles, which have the advantage that they do not impair the optical properties and at the same time greatly improve the mechanical properties of the adhesive.
Hoenle offers various epoxy resin-based adhesives specifically for fixing and aligning photodiodes and optical fibers for recording optical signals.
All adhesives exhibit low thermal expansion and stress on the underlying fine electronics, as well as good resistance to chemicals and the influence of media. In addition, the properties of the adhesives for optoelectronics are designed to have low shrinkage and low outgassing.
The table below lists a selection of adhesives that are suitable for applications in optoelectronics. Further products and custom solutions are available on request. To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Application Areas | Viscosity [mPas] | Base | Curing * | Special Properties |
|---|---|---|---|---|---|
|
600-1,250 | epoxy | UV |
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350-850 (LVT, 25 °C, Sp. 3/60 rpm) | epoxy | UV secondary heat cure |
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200-400 (LVT, 25°C, Sp. 2/30 rpm) | epoxy | UV secondary heat cure |
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*UV = 320 – 390 nm VIS = 405 nm
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