Die Attach Adhesives
Electrically conductive adhesives are used for die attach applications or for contacting semiconductors. Conductive adhesives are the perfect solution for making electrical contacts on circuit boards and other temperature-sensitive substrates, as their curing temperature lies clearly below soldering temperature. In addition these adhesives are much more flexible than solder and are therefore better able to withstand vibrations. They can also be jet-printed or plotted, allowing the production of much more delicate conductors than can be achieved with soldering. A further advantage over soldering is that conductive adhesives are lead- and solvent-free. These adhesives are used, for example, in many sensitive structures on circuit boards, such as LCD connections or for contacting FPC (flexible printed circuits).
Conductive adhesives are the perfect solution for mounting temperature-sensitive chips on smart cards, as their curing temperatures lie clearly below soldering temperature. In addition these adhesives are much more flexible than solder and are therefore better able to withstand bending of the smart card. A further advantage over soldering is that conductive adhesives are lead- and solvent-free.
With its Elecolit® range Hoenle offers a broad spectrum of electrically conductive adhesives: single-component adhesives that can be simply applied with dispensers or jets or screen-printed, as well as two-component products that cure at room temperature and have a long storage life.
The table below lists a selection of electrically conductive adhesives from Hoenle. Further products and custom solutions are available on request. To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Application Areas | Viscosity [mPas] | Base | Curing | Special Properties |
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80,000-90,000 Mix, 25,000-35,000 part A, 60,000-70 000, part B, (Rheometer, 25 °C, 10s^-1) | 2 component epoxy | thermal room temperature |
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10,000 – 15,000 (Rheometer 10s^-1) | epoxy | thermal |
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4,000-8,000 | epoxy | thermal |
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5,000-15,000 (Rheometer 10s^-1) | epoxy | thermal |
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20,000-40,000 | epoxy | thermal |
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