Connector Bonding and Sealing

Connectors and plug connectors, for example for headphones or charging cables, can be easily and reliably attached to printed circuit boards using modern adhesives. The latest generation of structural and UV adhesives have a very low ion content, optimally adapted to the requirements of the electronics and automotive industries.

Adhesives that cure at low temperatures from 60°C or dual-curing UV adhesives that set in shadow zones due to humidity are particularly suitable for bonding connectors and plug connectors. The low temperature load protects temperature-sensitive components.

After curing, Hoenle adhesives are flexible, vibration-resistant and resistant to the effects of media.

In the following table you will find a selection of Hoenle adhesives that are suitable for fixing plugs and connectors. Other products or customized solutions are available on request. Technical data sheets can be downloaded by clicking on the adhesive name.

Adhesive Application Areas Viscosity [mPas] Base Curing * Special Properties
- 1,200-2,000 (Rheometer, 25°C, 10s^-1) epoxy thermal at 60°C
  • Non-conductive
  • Outstanding adhesion to high performance
  • plastics (LCP, PBT)
  • High purity
  • Electronic grade standard
  • Flexible
- 5,000-10,000 (Rheometer, 25°C, 10s^-1) epoxy thermal at 60°C
  • Non-conductive
  • Outstanding adhesion to high performance plastics (LCP, PBT)
  • High purity
  • Electronic grade standard
  • Good mechanical stability
  • Good chemical resistance
  • Fixing components,
  • sensor encapsulation in automotive/aerospace industry,
  • bonding lenses,
  • bonding plastic parts and plastic housings
4,000-6,000 epoxy UV secondary heat cure
  • Perfect solution for bonding flexible circuit paths
  • resistant to reflow processes
  • grey color
  • Protective encapsulation of electronic components on PCBs
  • Consumer electronics
5,000-8,000 (Rheometer, 25°C, 10s^-1) acrylate UV VIS moisture cure
  • High Tg
  • Fast curing
  • Compatible with flux
  • Low ion content
  • Consumer Electronics
  • Protective encapsulation of electronic components on PCBs
3,000-6,000 (Rheometer, 25°C, 10s^-1) acrylate UV / VIS / Moisture postcuring
  • High Tg, fast curing
  • Compatible with flux
  • Low ion content
  • Passed UL94 HB test
- 6.000-11.000 (Rheometer, 25 °C, 10s^-­1) epoxy UV secondary heat cure
  • Perfect solution for bonding flexible circuit paths,
  • grey color,
  • high adhesion to flexible conductor paths and metals,
  • low ion content (electronic grade,

*UV = 320 – 390 nm          VIS = 405 nm

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