Glob Top Sealing Compounds
Sealing compounds and encapsulants are often used in electronics as so-called glob tops to protect electronic components. They protect components from moisture, dust, dirt and solvents. Glob tops also protect sensitive components from mechanical strain and scratching.
All Hoenle sealing compounds and encapsulants are made without solvent and many have a low ionic content of less than 10 ppm Na+, K+, Cl- and Br-. They therefore provide perfect protection from internal corrosion and reduce local voltaic coupling.
Many sealing compounds are UV-curing, allowing rapid setting in just a few seconds. This makes them suitable for encapsulating components in fully automated high-volume production. Thermally curing sealing compounds, on the other hand, have the advantage of curing even in shaded areas that the UV light cannot reach. Glob tops with black pigmentation, which are used as covers or coatings, can normally only be heat-cured.
After curing, all Hoenle glob top sealing compounds withstand short-term temperatures of up to 280°C and remain unaffected by reflow processes. Hoenle’s glob top adhesives are easy to process, highly flexible and have a high peel and shear strength.
Black&Light Adhesives
What is new is that many of our black adhesives can now also be cured with UV light in thick layers. This new Black&Light technology allows complete curing with UV light without resorting to secondary curing mechanisms. This technology is compatible with most of Hoenle’s epoxy-based Vitralit® adhesives. Depending on the application, the black coloration and layer thickness of the adhesives can be individually adjusted.
Another major advantage of the new Black&Light adhesives is storage: while conventional black-filled epoxy resin adhesives usually have to be stored deep-frozen, the Black&Light epoxy resins can be stored and shipped at room temperature or refrigerated, depending on the adhesive.
You can find more information on these adhesives on our Black&Light page.
The table below lists a selection of sealing compounds suitable for glob tops. Further products and custom solutions are available on request.
To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Application Areas | Viscosity [mPas] | Base | Curing * | Special Properties |
|---|---|---|---|---|---|
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3,000-5,000 | epoxy | UV secondary heat cure |
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3,000-5,000 | epoxy | UV |
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9,000-14,000 (Rheometer, 10s^-1) | epoxy | UV secondary heat cure |
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9,000-14,000 (Rheometer, 10s^-1) | epoxy | UV secondary heat cure |
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1,200-2,000 | epoxy | UV |
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20,000-40,000 | epoxy | UV secondary heat cure |
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3,500-7,000 (Rheometer, 25 °C, 10s^-1) | epoxy | UV |
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3,500-7,000 (Rheometer, 25 °C, 10s^-1) | epoxy | UV |
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3,500-7,000 (Rheometer, 25 °C, 10s^-1) | epoxy | UV/VIS |
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4,000-6,000 | epoxy | UV secondary heat cure |
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8,000-11,000 (Rheometer, 25 °C, 5s-1) | acrylate | UV VIS secondary moisture cure |
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5,000-8,000 (Rheometer, 25°C, 10s^-1) | acrylate | UV VIS moisture cure |
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3,000-6,000 (Rheometer, 25°C, 10s^-1) | acrylate | UV / VIS / Moisture postcuring |
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2,000-4,000 (Rheometer, 25°C, 5s^-1) | acrylate | UV / VIS |
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3,000-8,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
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7,000-11,000 (Rheometer, 25°C, 5s^-1) | epoxy | thermal |
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25,000-50,000 ( Rheometer, 25 °C, 10s-1 ) | epoxy | thermal |
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80,000-150,000 (Rheometer, 25 °C, 10s^-1 ) | epoxy | thermal |
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6,000-10,000 (Rheometer, 25°C, 10s^-1) | epoxy | thermal |
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20,000-30,000 (Rheometer, 25 °C, 20s ^-1) | epoxy | thermal |
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30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm) | epoxy | thermal |
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6,500-7,500 (Rheometer, 25°C, 20s^-1) | epoxy | thermal |
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*UV = 320 – 390 nm VIS = 405 nm
Contact And Support
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