Black&Light Technology

Black&Light Technology

Conventional black adhesives are absorbing a high percentage of light intensity. For this reason, uv curable adhesives are generally transparent. If common black adhesives are cured with uv light, they cure only in very small layers of a few microns. This results in surface “skin” formation, but not a complete cure. Usually, a secondary curing mechanism is then necessary, for example with heat.

With the new Black&Light technology from Hoenle black adhesives can now be cured in deeper layers up to a few millimeters with uv light. During the curing process, the Black & Light technology within the adhesive enables the UV rays to penetrate and complete a full cure.  Once the adhesive polymerization is complete, the structure of the Black&Light technology prohibits light transmission. Thus, black adhesives with high optical density can now be cured in a single curing step with uv light only. This process is irreversible.

These new Black&Light adhesives are mainly targeted at applications in optical bonding and optoelectronics where high optical density is needed. They are also suitable for optoelectronic applications to help minimize reflections and enhance sensor transmission values, or the black uv epoxies can be applied as glob top or encapsulation.

Black&Light Compatible with most Vitralit® Epoxys

The Black&Light technology is compatible with most epoxy-based Vitralit® adhesives from Hoenle. The technology has no influence on the halogen content. The Black&Light adhesive systems can be very specifically adapted to specifications of the respective application for amount of light blocking and depth of cure.

Another major advantage of the Black&Light adhesives is storage: As the the Black & Light epoxy adhesives do not cure at room temperature or elevated temperatures, they can be stored and shipped at room temperature or under normal refrigeration and need not to be stored deep-frozen.

The table below provides an overview of Hoenle Black&Light adhesives. More adhesives are available on request. To download the technical datasheets (TDS) please click on the adhesive name.

Adhesive Application Areas Viscosity [mPas] Base Curing * Special Properties
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization
  • medical devices
  • optics
  • electronics
  • lens bonding
  • light shielding
3,500-7,000 (Rheometer, 25 °C, 10s^-1) epoxy UV/VIS
  • black colour
  • low shrinkage
  • low CTE
  • high glass transition temperature
  • good chemical resistance
  • resistant to sterilization

*UV = 320 – 390 nm     VIS = 405 nm

Contact And Support

Do you have any questions or need support for our bonding solutions? We are happy to help you.

Our Bonding and Curing System Solutions

Scroll to Top