Sensor Technology

It is impossible to imagine the automotive and vehicle industry without sensor technology. Sensors detect physical or chemical properties such as temperature, humidity, pressure, force or acceleration and convert them into an electrical signal that can be further processed. In some cases, sensors must function in critical environments without failure and for as long as possible. Hoenle adhesives are used in sensor technology to fix and/or protect components, for shielding, heat dissipation or electrical contacting.

Sensor technology is used both in the interior and exterior of vehicles. Sensors must be adapted to the environment and withstand temperature fluctuations, humidity, media resistance, vibrations and other conditions. Hoenle adhesives, sealants and potting compounds are ideally suited for this purpose, as they not only protect but also bond sensor components. Sensors in outdoor areas are also exposed to humidity and rain, where glob tops or pottings with low ion content from Hoenle offer additional protection against corrosion.

In addition to the environment, other factors such as substrates, surface conditions or thermal expansion coefficient play a decisive role in the selection of the potting or connecting compound. The choice of process can also contribute significantly to product recommendation. UV-curing products in particular are an efficient and fast method for casting or bonding. The viscosity settings can be continuously optimized and adjusted here. Hoenle offers competent advice based on many years of know-how and a wide range of products for this area.

Material in possible shadowed areas can be safely cured by dual-curing products. Here, the adhesive on the sensor or component is first fixed with UV light. In a second step, the adhesive then cures with heat or moisture in the non-exposed areas.

A Structalit® adhesive is used as potting on a sensor board.

In the following table you will find a selection of adhesives suitable for the various applications in sensor technology. Further products and customer-specific solutions are available on request. Technical data sheets can be downloaded by clicking on the adhesive name.

Adhesive Application Areas Viscosity [mPas] Base Curing * Special Properties
  • Frame material for frame & fill applications
9,000-14,000 (Rheometer, 10s^-1) epoxy UV secondary heat cure
  • Stable frame compound
  • high ion purity
  • electronic grade adhesive
  • high temperature conductivity
  • low water absorption
  • UL94 HB test passed
  • Glob top encapsulation
  • Encapsulation of electronic components
  • Bonding of electronic components
  • Fill material for frame&fill
20,000-30,000 (Rheometer, 25 °C, 20s ^-1) epoxy thermal
  • Black color
  • excellent flow properties
  • filling material for frame and fill applications on PCBs,
  • very high resistance to heat and chemicals
  • Potting
  • Sealing
  • Protection of sensitive components
19,000-32,000 (Rheometer, 25°C, 10s^-1) acrylate UV VIS
  • Acrylate hybrid
  • superior strength
  • low thermal expansion
  • impact resistant
  • low shrinkage
  • resistant to soldering stress
  • excellent flow properties
  • Glob Top
  • Potting Material
  • Encapsulation of electronic components
  • Conformal Coating
3,000-5,000 epoxy UV secondary heat cure
  • Very high Tg
  • low water absorption
  • low ion content
  • very high chemical resistance
  • Conformal Coating,
  • Encapsulation of electronic components
160-300 epoxy UV secondary heat cure
  • Dry surface after UV-curing
  • autoclavable
  • excellent chemical resistance
  • scratch resistant coating
  • Bonding of flexible components;
  • Attaching components on PCBs
900-1,500 (LVT, 25°C, Sp. 3/30 rpm) acrylate UV VIS
  • Dry surface after curing,
  • biocompatible: certified to USP Class VI and ISO 10993-5 standards
  • Bonding of flexible components;
  • Attaching components on PCBs
4,000-8,000 acrylate UV VIS
  • dry surface after curing
  • flexible and tear-proof
  • excellent adhesion to many plastics
  • Encapsulation of electronic components
3,000-8,000 acrylate UV secondary heat cure
  • Very high adhesion to metals and sintered materials
  • Encapsulation of electronic components
1,000-1,500 acrylate UV VIS
  • Elastic
  • high peel strength
  • optically clear
  • very flexible
  • suitable for potting
  • Fixing components,
  • sensor encapsulation in automotive/aerospace industry,
  • bonding lenses,
  • bonding plastic parts and plastic housings
4,000-6,000 epoxy UV secondary heat cure
  • Perfect solution for bonding flexible circuit paths
  • resistant to reflow processes
  • grey color
  • Bonding heat-sensitive components;
  • Heat dissipation
80,000-90,000 Mix, 25,000-35,000 part A, 60,000-70 000, part B, (Rheometer, 25 °C, 10s^-1) 2 component epoxy thermal room temperature
  • electrically conductive (ICA)
  • thermally conductive
  • Heat dissipation
20,000-40,000 epoxy thermal
  • electrically conductive (ICA)
  • thermally conductive
  • stable
  • flexible
  • Sensor bonding
  • Dissipation of heat
  • Potting
12,000-20,000 (LVT, 25 °C, Sp. 4/6 rpm) epoxy thermal
  • thermally conductive, solvent-free,
  • white color,
  • excellent bonding to metals,
  • very good flow properties
  • Dissipation of heat
95 000 - 115 000 (LVT, 25 °C, Sp. 4/3 rpm) epoxy thermal
  • thermally conductive
  • grey color
  • very good adhesion to metal
  • excellent flow properties
  • Attaching components on PCBs,
  • Encapsulation of electronic components,,
  • Encapsulation of plastic parts,
  • Potting material
30,000-45,000 (LVT, 25°C, Sp. 4/6 rpm) epoxy thermal
  • Epoxy-based resin
  • resistant to high temperatures and oil/grease
  • perfect choice for ring applications
  • Attaching components on PCBs;
  • Encapsulation or potting of electronic components
6,500-7,500 (Rheometer, 25°C, 20s^-1) epoxy thermal
  • Black color
  • flexible potting compound
  • excellent flow properties

*UV = 320 – 390 nm          VIS = 405 nm

Bonding solutions for sensors

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