Edge Bonding and Corner Bonding
Edge bondings or corner bondings are adhesives designed to contribute to the stability of sensitive and/or higher components, capacitors or battery cells on printed circuit boards. In addition, these edge or corner bonds ensure the reduction of stresses in sensitive connections, even under high shock and vibration loads and many fatigue cycles. They offer high adhesive strength as well as very good temperature and chemical resistance.
Most edge bonders from Hoenle are stable UV-curing adhesives which, depending on the adhesive, also thermally post-cure in shadow zones. Due to their low curing temperatures, they are also suitable for temperature-sensitive components. After curing, they exhibit low shrinkage behavior.
On request, these adhesives are also available in red or fluorescent coloring to ensure optimum quality and application control: The red coloring or fluorescence makes the quality of the bonding on each individual component easily visible and controllable, even in mass production. The red color in particular stands out visually from the mostly green PCBs.
In the table below you will find a selection of Hoenle adhesives that are suitable for edge bonding or corner bonding. Other products or customized solutions are available on request.
To download the technical datasheets (TDS) please click on the adhesive name.
| Adhesive | Application Areas | Viscosity [mPas] | Base | Curing * | Special Properties |
|---|---|---|---|---|---|
| - | 7,000-12,000 | epoxy | thermal |
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9,000-14,000 (Rheometer, 10s^-1) | epoxy | UV secondary heat cure |
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| - | 8,000-17,000 (Rheometer, 25°C, 10s^-1) | acrylate | UV secondary heat cure |
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4,000-8,000 | acrylate | UV VIS |
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*UV = 320 – 390 nm VIS = 405 nm
Contact And Support
Do you have any questions or need support for our bonding solutions? We are happy to help you.
