Bonding Solutions in Electronics
The production of electronic components is becoming increasingly challenging: manufacturers of computers, mobile telephones and laptops are demanding ever higher levels of quality and performance while products and their components are becoming ever smaller and lighter.
This technological development in the electronics sector is also made possible by the use of state-of-the-art adhesives, which are replacing soldered joints and provide shielding and encapsulation of components. Some complex materials cannot, furthermore, be soldered due to their high temperature-sensitivity. In addition to providing good adhesion, a key requirement in electronics application on adhesives is that they must allow precise application at high production rates. Hoenle has developed special-purpose adhesives that meet the specific requirements of many applications in the field of electronics.
Overview of Bonding Applications in Electronics
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